Product catalog
The range of Input/Output Expansion Enclosures are all designed to extend the I/O capacity of industrial automation systems by housing and connecting additional I/O modules in a structured, space-efficient manner. These enclosures support centralized and distributed configurations, allowing for scalable system architectures without compromising reliability or performance.
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Typically used in conjunction with ICP DAS programmable automation controllers (PACs) and communication modules, these enclosures provide backplane connectivity, power distribution, and physical mounting for a range of digital, analog, and special-purpose I/O modules. Depending on the model, you can buy I/O expansion enclosures compatible with bus systems such as I-7000, I-8000, and CANopen, as well as industrial fieldbus and Ethernet-based expansion methods.
Chassis sizes vary from compact units for smaller installations to multi-slot models supporting high channel counts. Enclosures are constructed with durable materials and designed for DIN-rail or panel mounting, with optional terminal blocks for simplified wiring and maintenance. Backplanes often feature hot-swappable slots, status indicators, and surge-protected power rails to minimize downtime and protect internal components.
Some models include integrated communication interfaces for local or remote access, while others act purely as passive carriers for I/O cards. Expansion enclosures may also support redundant power inputs, internal bus communication monitoring, and thermal or EMI shielding depending on system requirements.
These systems are particularly well-suited for applications that require modular growth, hardware segregation, or easy maintenance access—such as in building automation, substation monitoring, and machine control environments.
You can shop ICP DAS I/O expansion chassis and filter by supported module family, number of slots, power supply options, bus type compatibility, and mounting method to identify the optimal enclosure for your I/O expansion needs.
















































































