DIN-Rail Embedded PCs

Embedded DIN-Rail System, Intel 11th Gen Core i3/i5/i7 CPU, Up to 64GB DDR4 SODIMM RAM, HDMI/VGA, 3x2.5GbE LAN, 4xRS232/422/485, 4xUSB 2.0, 1x8-bit DIO, 1xSIM, 1xM.2 Key-B, 1xM.2 Key-M, 1xFull-Size Mini-PCIe, Audio, 9-36VDC-in, -20..60C

Embedded DIN-Rail System, Intel 11th Gen Core i3/i5/i7 CPU, Up to 32GB DDR4 SODIMM RAM, 4xHDMI, 3x2.5GbE LAN, 2xRS232/422/485, 2xUSB 3.0, 2xUSB 2.0, 1xM.2 Key-B, 1xM.2 Key-M, Hailo-8 Accelerator, 9-36VDC-in, -20..60C

Embedded DIN-Rail System, Intel 11th Gen Core i3/i5/i7 CPU, Up to 32GB DDR4 SODIMM RAM, 4xHDMI, 3x2.5GbE LAN, 2xRS232/422/485, 2xUSB 3.0, 2xUSB 2.0, 1xM.2 Key-B, 1xM.2 Key-M, 9-36VDC-in, -20..60C

Embedded DIN-Rail System, Intel 11th Gen Core i3/i5/i7 CPU, Up to 32GB DDR4 SODIMM RAM, 1xHDMI, 1xGbE LAN, 3x2.5GbE LAN, 2xRS232/422/485, 3xUSB 3.0, 2xUSB 2.0, 1xNano-SIM, 1xM.2 Key-B, 1xM.2 Key-M, Hailo-8 Accelerator, 12VDC-in, -20..60C

Embedded DIN-Rail System, Intel Elkhart Lake Atom/Celeron CPU, Up to 32GB DDR4 SODIMM RAM, 2xHDMI, 3x2.5GbE LAN, 2xRS232/422/485, 1xUSB 3.0, 2xUSB 2.0, 2xM.2 Key-B, 1xNano-SIM, Hailo-8 Accelerator, 9-24VDC-in, 0..60C or -20..60C

Embedded DIN-Rail System, Intel Elkhart Lake Atom/Celeron CPU, 8GB LPDDR4 RAM, 2xHDMI, 2x2.5GbE LAN, 1xRS232/422/485, 2xRS232, 2xUSB 3.0, 4xUSB 2.0, 1xNano-SIM, 1xM.2 Key-B, 1xMini-PCIe with Hailo-8 Accelerator, 9-24VDC-in, 0..60C or -20..60C

Embedded DIN-Rail System, Intel Elkhart Lake Atom/Celeron CPU, 8GB LPDDR4 RAM, 2xHDMI, 2x2.5GbE LAN, 1xRS232/422/485, 2xRS232, 2xUSB 3.0, 4xUSB 2.0, 1xNano-SIM, 1xM.2 Key-B, 1xMini-PCIe, 9-24VDC-in, 0..60C or -20..60C

Embedded DIN-Rail System, Intel 11th Gen Core i3/i5/i7 CPU, Up to 32GB DDR4 SODIMM RAM, 1xHDMI, 1xGbE LAN, 3x2.5GbE LAN, 2xRS232/422/485, 3xUSB 3.0, 2xUSB 2.0, 1xNano-SIM, 1xM.2 Key-B, 1xM.2 Key-M, Hailo-8 Accelerator, 12VDC-in, -20..60C

Embedded DIN-Rail System, Intel 11th Gen Core i3/i5/i7 CPU, Up to 32GB DDR4 SODIMM RAM, 1xHDMI, 1xGbE LAN, 3x2.5GbE LAN, 2xRS232/422/485, 3xUSB 3.0, 2xUSB 2.0, 1xNano-SIM, 1xM.2 Key-B, 1xM.2 Key-M, 12VDC-in, -20..60C

Embedded DIN-Rail System, Intel Elkhart Lake Atom/Celeron CPU, Up to 32GB DDR4 SODIMM RAM, 2xHDMI, 3x2.5GbE LAN, 2xRS232/422/485, 2xUSB 3.0, 3xUSB 2.0, 2xM.2 Key-B, 1xNano-SIM, 9-24VDC-in, 0..60C or -20..60C

ATEX/CID2 Certified Din-rail Fanless Embedded System with Intel Intel Atom Processor x5-E3930 1.3-1.8GHz, DDR3L up to 8GB, 3xGbE LAN, 6xCOM, DIO, 2.5" SATA SSD/HDD bay, CF, 3xMiniPCIe, 9-36V DC, -40..70C

Fanless DIN-Rail Embedded System, Intel 11th Gen Core i7-1185G7E CPU, 8GB DDR4 RAM, 2xHDMI, 1xDP, 3x2.5GbE LAN, 4xCOM, 2xUSB 3.2 Gen 2, 1xM.2 2230 A-Key, 1xM.2 3042/3052 B-Key, 1x2.5" Drive Bay, 12VDC-in DC Jack, -20..60C Wide temp.

Fanless DIN-Rail Embedded System, Intel 11th Gen Core i5-1145G7E CPU, 8GB DDR4 RAM, 2xHDMI, 1xDP, 3x2.5GbE LAN, 4xCOM, 2xUSB 3.2 Gen 2, 1xM.2 2230 A-Key, 1xM.2 3042/3052 B-Key, 1x2.5" Drive Bay, 12VDC-in DC Jack, -20..60C Wide temp.

Fanless DIN-Rail Embedded System, Intel 11th Gen Core i3-1115G4E CPU, 8GB DDR4 RAM, 2xHDMI, 1xDP, 3x2.5GbE LAN, 4xCOM, 2xUSB 3.2 Gen 2, 1xM.2 2230 A-Key, 1xM.2 3042/3052 B-Key, 1x2.5" Drive Bay, 12VDC-in DC Jack, -20..60C Wide temp.

Fanless DIN-Rail Embedded System, Intel 11th Gen Celeron 6305 CPU, 8GB DDR4 RAM, 2xHDMI, 1xDP, 3x2.5GbE LAN, 4xCOM, 2xUSB 3.2 Gen 2, 1xM.2 2230 A-Key, 1xM.2 3042/3052 B-Key, 1x2.5" Drive Bay, 12VDC-in DC Jack, -20..60C Wide temp.

Industrial DIN-Rail Fanless System, Intel Celeron J6412 2.0GHz CPU, Up to 32GB DDR4 RAM, HDMI, VGA, 2xGbE LAN, 2xUSB 2.0, 2xUSB 3.2, 4xRS232/422/485, 1xM.2 M-Key, 1xM.2 E-Key, 1xM.2 B-Key, SIM, 1x8-bit GPIO, Audio, 9-36VDC-in Terminal Block, 0..50C

Embedded Automation System, Intel Atom x7433E CPU, 8GB LPDDR5 RAM, 64GB eMMC, 1xM.2 2242/3052 Key-B (SATA), 1xHDMI, 3x2.5GbE LAN, 2xUSB 3.2, 1xUSB Type-C DP/PD, 2xRS232/485 2.5KV isolation, 8-bit DIO, 1xFieldbus slot, 1xMiniPCIe, 12-24VDC-in

Fanless Fieldbus Box-PC NIFE-106, Intel N97 2.0GHz CPU, 8GB LPDDR5 RAM, 64GB eMMC, 1xHDMI, 3x2.5GbE LAN, 2xUSB 3.2, 1xRS232/485 2.5KV isolation, 12/24VDC-in

DIN-Rail Bedrock RAI300 PC, AMD Ryzen AI 9 HX370 CPU, 15W TDP, Up to 128GB DDR5 RAM, HDMI+USB4 or HDMI/DP/2xMiniDP, Up to 4x2.5GbE LAN, Up to 4xUSB 3.2, 1xMiniUSB, Up to 4xM.2 (3xKey-M NVME/Hailo, 1xKey-B LTE), Up to 12-60VDC-in w/ Power Module

DIN-Rail Bedrock RAI300 PC, AMD Ryzen AI 9 HX370 CPU, 60W TDP, Up to 128GB DDR5 RAM, HDMI+USB4 or HDMI/DP/2xMiniDP, Up to 4x2.5GbE LAN, Up to 4xUSB 3.2, 1xMiniUSB, Up to 4xM.2 (3xKey-M NVME/Hailo, 1xKey-B LTE), Up to 12-60VDC-in w/ Power Module

Fanless Embedded Din-Rail Box PC, Intel 12/13th Gen Core i3/i5/i7 CPU (35W Max), H610E Chipset, Up to 32GB DDR5 RAM, DP/VGA, 1x2.5GbE LAN, 2xGbE LAN, 4xUSB 3.2, 2xUSB 2.0, 2xUSB 2.0 Int., 2xCOM, 1xMiniPCIe, 1xM.2 Key-M, 1xM.2 Key-E, 12-24VDC-In, R1.0

Robust Din-rail Fanless Embedded system with Intel Atom E3815 1.46GHz, 4 x RS-232/422/485, 2 x 10/100/1000 Ethernet,1 x CF, 1 x SATA 2.5", VGA, 1xSIM, 2xUSB, DIO, 12-24V DC, w/Power Button

Robust Din-rail Fanless Embedded system with Intel Atom E3827 1.75GHz, 4 x RS-232/422/485, 2 x 10/100/1000 Ethernet,1 x CF, 1 x SATA 2.5", VGA, 1xSIM, 2xUSB, DIO, 12-24V DC, with Power Button

Robust Din-rail Fanless Embedded system with Intel Celeron N3350 1.1GHz, DDR3L, VGA, 4x10/100/1000 Ethernet PoE, 1xRS-232/422/485, 1xCAN, 2xUSB 3.0, 2.5" SATA, mSATA, 2xMiniPCIe, IP40, -40...+70C