nROK-1040-A
NEXCOM
SKU: 80311700
Fanless Railway Box PC, Intel Atom x7213RE CPU, 8GB DDR5 RAM, VGA, HDMI, 3x2.5GbE M12 X-coded LAN, 1xMultiport (CAN/DIO), 1xUSB 3.2, 1xUSB 2.0, 4xCOM, GPS, 1x2.5" Drive Bay, 1xMiniPCIe, 1xM.2 Key-B, 1xM.2 Key-E, Audio, 24VDC-in M12 A-coded, 12VDC-out
Price on request
Available
Available
Construction
Construction Chassis
Aluminium Chassis
Mounting Configuration
Desktop, Wall
Type
Fanless
CPU
СPU Generation/Family
Amston Lake
Processor Installed
Intel Atom x7213RE
Socket
FCBGA1264
Max CPU frequency
3.4 GHz
Chipset
Chipset
Intel SoC
Memory
Form-factor
DDR5
Socket Type
1xSODIMM
ECC
No
Default on Board Memory
8 GB
Maximum Memory
16 GB
Assembly
Removable
Graphic
Graphic Controller
Integrated in CPU
Interfaces
HDMI, VGA
Ethernet
Total Ethernet
3
2,5 Gbit/s
3
Wi-Fi
Wi-Fi Standard
Yes (Optional)
Interfaces
COM Total
4
RS-232
2
RS-232/422/485
2
USB Total
2
USB 2.0
1
USB v3.x
1
Digital Input-Output
Channels of DIO
8
Industrial Interfaces
CAN Port
1
Drive interfaces
SATA 3
1
mSATA
1
Storage Cage
Number Of Cage External
1
2.5" Cage Intenal
1
Extension Slots
M.2
2
M.2 Form Factor
2230 E, 3052 B, 3042 B, 3050 B
Mini-PCIe/Mini Card
1
SIM Card slots
Yes, 2, Nano SIM
Antenna characteristics
Cellular interfaces
4G (Optional)
Additional Functions
GPS
GPS, GLONASS
LED / Controls
LED
Power LED, WLAN LED, LAN LED
Controls
On/Off, 1xReset
Connectors
Connectors
DB15 VGA, HDMI, 2xUSB, 12V DC Output, M12 DC-in, 3xM12 LAN, DB9 Audio, DB15 Multi-port, 2xDB15 (4xCOM)
System Power Input
Input Voltage DC
9..36 V
Power Supply
Supported Types of Power Supply
External power adapter AC/DC
Software
Operating System Compatibility
Linux OS, Windows 10 IoT Enterprise, Windows 10, Windows 11, Windows 11 IoT Enterprise
Dimensions and weight
Width
185 mm
Height
55 mm
Depth
125 mm
Operating Conditions
Operating Temperature
-40..70 °C
Humidity
10-95%
Standards and Certifications
Certifications
CE, FCC Class A, EN50155/50121
EMS
EN 50121-1, EN 50121-3-2
MIL-STD-810
MIL-STD-810H Test Method 516.8 Shock, MIL-STD-810H Test Method 514.8 Vibration
Rolling Stock
EN 45545-2
Vibration And Shock
EN 61373 Category 1 Class B, IEC 60068-2-64
Dimensions
Net Weight
1.36 kg
Gross Weight
1.95 kg
Construction
Construction Chassis
Aluminium Chassis
Mounting Configuration
Desktop, Wall
Type
Fanless
CPU
СPU Generation/Family
Amston Lake
Processor Installed
Intel Atom x7213RE
Socket
FCBGA1264
Max CPU frequency
3.4 GHz
Chipset
Chipset
Intel SoC
Memory
Form-factor
DDR5
Socket Type
1xSODIMM
ECC
No
Default on Board Memory
8 GB
Maximum Memory
16 GB
Assembly
Removable
Graphic
Graphic Controller
Integrated in CPU
Interfaces
HDMI, VGA
Ethernet
Total Ethernet
3
2,5 Gbit/s
3
Wi-Fi
Wi-Fi Standard
Yes (Optional)
Interfaces
COM Total
4
RS-232
2
RS-232/422/485
2
USB Total
2
USB 2.0
1
USB v3.x
1
Digital Input-Output
Channels of DIO
8
Industrial Interfaces
CAN Port
1
Drive interfaces
SATA 3
1
mSATA
1
Storage Cage
Number Of Cage External
1
2.5" Cage Intenal
1
Extension Slots
M.2
2
M.2 Form Factor
2230 E, 3052 B, 3042 B, 3050 B
Mini-PCIe/Mini Card
1
SIM Card slots
Yes, 2, Nano SIM
Antenna characteristics
Cellular interfaces
4G (Optional)
Additional Functions
GPS
GPS, GLONASS
LED / Controls
LED
Power LED, WLAN LED, LAN LED
Controls
On/Off, 1xReset
Connectors
Connectors
DB15 VGA, HDMI, 2xUSB, 12V DC Output, M12 DC-in, 3xM12 LAN, DB9 Audio, DB15 Multi-port, 2xDB15 (4xCOM)
System Power Input
Input Voltage DC
9..36 V
Power Supply
Supported Types of Power Supply
External power adapter AC/DC
Software
Operating System Compatibility
Linux OS, Windows 10 IoT Enterprise, Windows 10, Windows 11, Windows 11 IoT Enterprise
Dimensions and weight
Width
185 mm
Height
55 mm
Depth
125 mm
Operating Conditions
Operating Temperature
-40..70 °C
Humidity
10-95%
Standards and Certifications
Certifications
CE, FCC Class A, EN50155/50121
EMS
EN 50121-1, EN 50121-3-2
MIL-STD-810
MIL-STD-810H Test Method 516.8 Shock, MIL-STD-810H Test Method 514.8 Vibration
Rolling Stock
EN 45545-2
Vibration And Shock
EN 61373 Category 1 Class B, IEC 60068-2-64
Dimensions
Net Weight
1.36 kg
Gross Weight
1.95 kg
Construction
Construction Chassis
Aluminium Chassis
Mounting Configuration
Desktop, Wall
Type
Fanless
CPU
СPU Generation/Family
Amston Lake
Processor Installed
Intel Atom x7213RE
Socket
FCBGA1264
Max CPU frequency
3.4 GHz
Chipset
Chipset
Intel SoC
Memory
Form-factor
DDR5
Socket Type
1xSODIMM
ECC
No
Default on Board Memory
8 GB
Maximum Memory
16 GB
Assembly
Removable
Graphic
Graphic Controller
Integrated in CPU
Interfaces
HDMI, VGA
Ethernet
Total Ethernet
3
2,5 Gbit/s
3
Wi-Fi
Wi-Fi Standard
Yes (Optional)
Interfaces
COM Total
4
RS-232
2
RS-232/422/485
2
USB Total
2
USB 2.0
1
USB v3.x
1
Digital Input-Output
Channels of DIO
8
Industrial Interfaces
CAN Port
1
Drive interfaces
SATA 3
1
mSATA
1
Storage Cage
Number Of Cage External
1
2.5" Cage Intenal
1
Extension Slots
M.2
2
M.2 Form Factor
2230 E, 3052 B, 3042 B, 3050 B
Mini-PCIe/Mini Card
1
SIM Card slots
Yes, 2, Nano SIM
Antenna characteristics
Cellular interfaces
4G (Optional)
Additional Functions
GPS
GPS, GLONASS
LED / Controls
LED
Power LED, WLAN LED, LAN LED
Controls
On/Off, 1xReset
Connectors
Connectors
DB15 VGA, HDMI, 2xUSB, 12V DC Output, M12 DC-in, 3xM12 LAN, DB9 Audio, DB15 Multi-port, 2xDB15 (4xCOM)
System Power Input
Input Voltage DC
9..36 V
Power Supply
Supported Types of Power Supply
External power adapter AC/DC
Software
Operating System Compatibility
Linux OS, Windows 10 IoT Enterprise, Windows 10, Windows 11, Windows 11 IoT Enterprise
Dimensions and weight
Width
185 mm
Height
55 mm
Depth
125 mm
Operating Conditions
Operating Temperature
-40..70 °C
Humidity
10-95%
Standards and Certifications
Certifications
CE, FCC Class A, EN50155/50121
EMS
EN 50121-1, EN 50121-3-2
MIL-STD-810
MIL-STD-810H Test Method 516.8 Shock, MIL-STD-810H Test Method 514.8 Vibration
Rolling Stock
EN 45545-2
Vibration And Shock
EN 61373 Category 1 Class B, IEC 60068-2-64
Dimensions
Net Weight
1.36 kg
Gross Weight
1.95 kg
Construction
Construction Chassis
Aluminium Chassis
Mounting Configuration
Desktop, Wall
Type
Fanless
CPU
СPU Generation/Family
Amston Lake
Processor Installed
Intel Atom x7213RE
Socket
FCBGA1264
Max CPU frequency
3.4 GHz
Chipset
Chipset
Intel SoC
Memory
Form-factor
DDR5
Socket Type
1xSODIMM
ECC
No
Default on Board Memory
8 GB
Maximum Memory
16 GB
Assembly
Removable
Graphic
Graphic Controller
Integrated in CPU
Interfaces
HDMI, VGA
Ethernet
Total Ethernet
3
2,5 Gbit/s
3
Wi-Fi
Wi-Fi Standard
Yes (Optional)
Interfaces
COM Total
4
RS-232
2
RS-232/422/485
2
USB Total
2
USB 2.0
1
USB v3.x
1
Digital Input-Output
Channels of DIO
8
Industrial Interfaces
CAN Port
1
Drive interfaces
SATA 3
1
mSATA
1
Storage Cage
Number Of Cage External
1
2.5" Cage Intenal
1
Extension Slots
M.2
2
M.2 Form Factor
2230 E, 3052 B, 3042 B, 3050 B
Mini-PCIe/Mini Card
1
SIM Card slots
Yes, 2, Nano SIM
Antenna characteristics
Cellular interfaces
4G (Optional)
Additional Functions
GPS
GPS, GLONASS
LED / Controls
LED
Power LED, WLAN LED, LAN LED
Controls
On/Off, 1xReset
Connectors
Connectors
DB15 VGA, HDMI, 2xUSB, 12V DC Output, M12 DC-in, 3xM12 LAN, DB9 Audio, DB15 Multi-port, 2xDB15 (4xCOM)
System Power Input
Input Voltage DC
9..36 V
Power Supply
Supported Types of Power Supply
External power adapter AC/DC
Software
Operating System Compatibility
Linux OS, Windows 10 IoT Enterprise, Windows 10, Windows 11, Windows 11 IoT Enterprise
Dimensions and weight
Width
185 mm
Height
55 mm
Depth
125 mm
Operating Conditions
Operating Temperature
-40..70 °C
Humidity
10-95%
Standards and Certifications
Certifications
CE, FCC Class A, EN50155/50121
EMS
EN 50121-1, EN 50121-3-2
MIL-STD-810
MIL-STD-810H Test Method 516.8 Shock, MIL-STD-810H Test Method 514.8 Vibration
Rolling Stock
EN 45545-2
Vibration And Shock
EN 61373 Category 1 Class B, IEC 60068-2-64
Dimensions
Net Weight
1.36 kg
Gross Weight
1.95 kg
Documentation
Documentation
Documentation
Documentation
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NEXCOM
SKU: 80311700
