Neu-X300-Q370
NEXCOM
SKU: 56983700
Fanless Edge Embedded Computing System, support i3/i5/i7 Core 8th Gen. CPUs , up to 32GB SO-DIMM DDR4, M.2 2280 M-Key SSD, TPM2.0, 3xHDMI, 2xGbE LAN, 1xCOM, 4xUSB 3.0, M.2 2230 M-Key for WiFi, 12V DC-in with external power adapter
Price on request
Available
Available
Construction
Construction Chassis
Metal Chassis
Type
Fanless
CPU
СPU Generation/Family
Coffee Lake
Socket
LGA1151
CPU Support Type
Core i3, Core i5, Core i7
Chipset
Chipset
Intel Q370
Memory
Form-factor
DDR4
Socket Type
2xSODIMM
Maximum Memory
32 GB
Graphic
Graphic Controller
Integrated in CPU
Ethernet
Total Ethernet
2
10/100/1000 Mbit/s
2
Interfaces
COM Total
1
RS-232/422/485
1
USB Total
4
USB v3.x
4
Extension Slots
PCI Express x16
1
M.2
1
Connectors
Connectors
DB9, 2xRJ45, 4xUSB, Audio Out, 4-pin DC input, 3xHDMI
System Power Input
Input Voltage DC
12..12 V
Power Supply
Type of Power Supply
External power adapter AC/DC
Output Power
96 W
Dimensions and weight
Width
200 mm
Height
54.4 mm
Depth
190 mm
Operating Conditions
Operating Temperature
-5..45 °C
Standards and Certifications
Certifications
CE, FCC Class A
Dimensions
Gross Weight
3 kg
Construction
Construction Chassis
Metal Chassis
Type
Fanless
CPU
СPU Generation/Family
Coffee Lake
Socket
LGA1151
CPU Support Type
Core i3, Core i5, Core i7
Chipset
Chipset
Intel Q370
Memory
Form-factor
DDR4
Socket Type
2xSODIMM
Maximum Memory
32 GB
Graphic
Graphic Controller
Integrated in CPU
Ethernet
Total Ethernet
2
10/100/1000 Mbit/s
2
Interfaces
COM Total
1
RS-232/422/485
1
USB Total
4
USB v3.x
4
Extension Slots
PCI Express x16
1
M.2
1
Connectors
Connectors
DB9, 2xRJ45, 4xUSB, Audio Out, 4-pin DC input, 3xHDMI
System Power Input
Input Voltage DC
12..12 V
Power Supply
Type of Power Supply
External power adapter AC/DC
Output Power
96 W
Dimensions and weight
Width
200 mm
Height
54.4 mm
Depth
190 mm
Operating Conditions
Operating Temperature
-5..45 °C
Standards and Certifications
Certifications
CE, FCC Class A
Dimensions
Gross Weight
3 kg
Construction
Construction Chassis
Metal Chassis
Type
Fanless
CPU
СPU Generation/Family
Coffee Lake
Socket
LGA1151
CPU Support Type
Core i3, Core i5, Core i7
Chipset
Chipset
Intel Q370
Memory
Form-factor
DDR4
Socket Type
2xSODIMM
Maximum Memory
32 GB
Graphic
Graphic Controller
Integrated in CPU
Ethernet
Total Ethernet
2
10/100/1000 Mbit/s
2
Interfaces
COM Total
1
RS-232/422/485
1
USB Total
4
USB v3.x
4
Extension Slots
PCI Express x16
1
M.2
1
Connectors
Connectors
DB9, 2xRJ45, 4xUSB, Audio Out, 4-pin DC input, 3xHDMI
System Power Input
Input Voltage DC
12..12 V
Power Supply
Type of Power Supply
External power adapter AC/DC
Output Power
96 W
Dimensions and weight
Width
200 mm
Height
54.4 mm
Depth
190 mm
Operating Conditions
Operating Temperature
-5..45 °C
Standards and Certifications
Certifications
CE, FCC Class A
Dimensions
Gross Weight
3 kg
Construction
Construction Chassis
Metal Chassis
Type
Fanless
CPU
СPU Generation/Family
Coffee Lake
Socket
LGA1151
CPU Support Type
Core i3, Core i5, Core i7
Chipset
Chipset
Intel Q370
Memory
Form-factor
DDR4
Socket Type
2xSODIMM
Maximum Memory
32 GB
Graphic
Graphic Controller
Integrated in CPU
Ethernet
Total Ethernet
2
10/100/1000 Mbit/s
2
Interfaces
COM Total
1
RS-232/422/485
1
USB Total
4
USB v3.x
4
Extension Slots
PCI Express x16
1
M.2
1
Connectors
Connectors
DB9, 2xRJ45, 4xUSB, Audio Out, 4-pin DC input, 3xHDMI
System Power Input
Input Voltage DC
12..12 V
Power Supply
Type of Power Supply
External power adapter AC/DC
Output Power
96 W
Dimensions and weight
Width
200 mm
Height
54.4 mm
Depth
190 mm
Operating Conditions
Operating Temperature
-5..45 °C
Standards and Certifications
Certifications
CE, FCC Class A
Dimensions
Gross Weight
3 kg
Documentation
Documentation
Documentation
Documentation
