NDiS-B561-PoE

NEXCOM
SKU: 10996100
Fanless Edge Embedded Computing System, Intel 12th Gen Core i3/i5/i7 CPU, Intel Q670E chipset, up to 64GB DDR5 RAM, 3xHDMI, 1xGbE LAN, 2xPoE LAN, 4xCOM, 8xUSB 3.2, 1x8-bit GPIO, Audio, SIM, 2xM.2 Key-M, 1xM.2 Key-B, 1xM.2 Key-E, 24VDC-in, 0..40C
Price on request
Available
Available
Construction
Construction Chassis
Metal Chassis
Mounting Configuration
Desktop, Wall
Type
Fanless
CPU
СPU Generation/Family
Alder Lake
Socket
LGA1700
CPU Support Type
Core i3, Core i5, Core i7
Chipset
Chipset
Intel Q670E
Memory
Form-factor
DDR4
Socket Type
2xSODIMM
ECC
No
Maximum Memory
64 GB
Graphic
Graphic Controller
Integrated in CPU
Interfaces
3xHDMI
Ethernet
Controller Type
Intel i226V
Total Ethernet
3
10/100/1000 Mbit/s
1
PoE+ 10/100/1000 Mbit/s
2
Interfaces
COM Total
4
RS-232
3
RS-232/422/485
1
USB Total
8
USB v3.x
8
Audio
Audio Controller
Intel HD Audio
Drive interfaces
M.2
2
Extension Slots
Total
4
M.2
4
M.2 Form Factor
2280 M, 2230 E, 3052 B, 3042 B
SIM Card slots
1
LED / Controls
LED
Power LED
Controls
On/Off
Connectors
Connectors
4xDB9, 2xRJ45, 8xUSB, Mic In, Line Out, SIM Card Slot, 3xHDMI
System Power Input
Input Voltage DC
12..24 V
Power Supply
Type of Power Supply
External power adapter AC/DC
Output Power
120 W
Software
Operating System Compatibility
Linux OS, Windows 10, Windows 11
Dimensions and weight
Width
238 mm
Height
67.1 mm
Depth
190 mm
Operating Conditions
Operating Temperature
-20..60 °C
Humidity
10-95%
Standards and Certifications
Certifications
CE, FCC Class A
Dimensions
Net Weight
3.6 kg
Gross Weight
4.6 kg
Construction
Construction Chassis
Metal Chassis
Mounting Configuration
Desktop, Wall
Type
Fanless
CPU
СPU Generation/Family
Alder Lake
Socket
LGA1700
CPU Support Type
Core i3, Core i5, Core i7
Chipset
Chipset
Intel Q670E
Memory
Form-factor
DDR4
Socket Type
2xSODIMM
ECC
No
Maximum Memory
64 GB
Graphic
Graphic Controller
Integrated in CPU
Interfaces
3xHDMI
Ethernet
Controller Type
Intel i226V
Total Ethernet
3
10/100/1000 Mbit/s
1
PoE+ 10/100/1000 Mbit/s
2
Interfaces
COM Total
4
RS-232
3
RS-232/422/485
1
USB Total
8
USB v3.x
8
Audio
Audio Controller
Intel HD Audio
Drive interfaces
M.2
2
Extension Slots
Total
4
M.2
4
M.2 Form Factor
2280 M, 2230 E, 3052 B, 3042 B
SIM Card slots
1
LED / Controls
LED
Power LED
Controls
On/Off
Connectors
Connectors
4xDB9, 2xRJ45, 8xUSB, Mic In, Line Out, SIM Card Slot, 3xHDMI
System Power Input
Input Voltage DC
12..24 V
Power Supply
Type of Power Supply
External power adapter AC/DC
Output Power
120 W
Software
Operating System Compatibility
Linux OS, Windows 10, Windows 11
Dimensions and weight
Width
238 mm
Height
67.1 mm
Depth
190 mm
Operating Conditions
Operating Temperature
-20..60 °C
Humidity
10-95%
Standards and Certifications
Certifications
CE, FCC Class A
Dimensions
Net Weight
3.6 kg
Gross Weight
4.6 kg
Construction
Construction Chassis
Metal Chassis
Mounting Configuration
Desktop, Wall
Type
Fanless
CPU
СPU Generation/Family
Alder Lake
Socket
LGA1700
CPU Support Type
Core i3, Core i5, Core i7
Chipset
Chipset
Intel Q670E
Memory
Form-factor
DDR4
Socket Type
2xSODIMM
ECC
No
Maximum Memory
64 GB
Graphic
Graphic Controller
Integrated in CPU
Interfaces
3xHDMI
Ethernet
Controller Type
Intel i226V
Total Ethernet
3
10/100/1000 Mbit/s
1
PoE+ 10/100/1000 Mbit/s
2
Interfaces
COM Total
4
RS-232
3
RS-232/422/485
1
USB Total
8
USB v3.x
8
Audio
Audio Controller
Intel HD Audio
Drive interfaces
M.2
2
Extension Slots
Total
4
M.2
4
M.2 Form Factor
2280 M, 2230 E, 3052 B, 3042 B
SIM Card slots
1
LED / Controls
LED
Power LED
Controls
On/Off
Connectors
Connectors
4xDB9, 2xRJ45, 8xUSB, Mic In, Line Out, SIM Card Slot, 3xHDMI
System Power Input
Input Voltage DC
12..24 V
Power Supply
Type of Power Supply
External power adapter AC/DC
Output Power
120 W
Software
Operating System Compatibility
Linux OS, Windows 10, Windows 11
Dimensions and weight
Width
238 mm
Height
67.1 mm
Depth
190 mm
Operating Conditions
Operating Temperature
-20..60 °C
Humidity
10-95%
Standards and Certifications
Certifications
CE, FCC Class A
Dimensions
Net Weight
3.6 kg
Gross Weight
4.6 kg
Construction
Construction Chassis
Metal Chassis
Mounting Configuration
Desktop, Wall
Type
Fanless
CPU
СPU Generation/Family
Alder Lake
Socket
LGA1700
CPU Support Type
Core i3, Core i5, Core i7
Chipset
Chipset
Intel Q670E
Memory
Form-factor
DDR4
Socket Type
2xSODIMM
ECC
No
Maximum Memory
64 GB
Graphic
Graphic Controller
Integrated in CPU
Interfaces
3xHDMI
Ethernet
Controller Type
Intel i226V
Total Ethernet
3
10/100/1000 Mbit/s
1
PoE+ 10/100/1000 Mbit/s
2
Interfaces
COM Total
4
RS-232
3
RS-232/422/485
1
USB Total
8
USB v3.x
8
Audio
Audio Controller
Intel HD Audio
Drive interfaces
M.2
2
Extension Slots
Total
4
M.2
4
M.2 Form Factor
2280 M, 2230 E, 3052 B, 3042 B
SIM Card slots
1
LED / Controls
LED
Power LED
Controls
On/Off
Connectors
Connectors
4xDB9, 2xRJ45, 8xUSB, Mic In, Line Out, SIM Card Slot, 3xHDMI
System Power Input
Input Voltage DC
12..24 V
Power Supply
Type of Power Supply
External power adapter AC/DC
Output Power
120 W
Software
Operating System Compatibility
Linux OS, Windows 10, Windows 11
Dimensions and weight
Width
238 mm
Height
67.1 mm
Depth
190 mm
Operating Conditions
Operating Temperature
-20..60 °C
Humidity
10-95%
Standards and Certifications
Certifications
CE, FCC Class A
Dimensions
Net Weight
3.6 kg
Gross Weight
4.6 kg

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