Aplex’s compact panel computers ARMPAC based on i.MX8M (Cortex A53)

03 November 2023 Product News

Aplex has launched new models of its ARMPAC series of panel computers. Two modern compact models with the necessary basic functionality, based on an ARM architecture processor, in a strict classic industrial design, are referred to as ARMPAC-607AP and ARMPAC-610AP.

The key feature of the new products is the architecture built on the basis of a 4-core i.MX8M Plus processor (Cortex A53) from NXP. This is a device that has a built-in neural processor (NPU) with a speed of up to 2.3 TOPS, the main task of which is to accelerate and expand machine learning algorithms in industrial and IoT (Internet of Things) systems. Predominant applications include person and object recognition for public safety, industrial machine vision, robotics, hand gestures and emotion detection with natural language processing, etc. The processor was released in 2020, and according to NXP promises, the support period will be at least 15 years.

i.MX8M Plus processor block diagram image

Let's take a closer look at the main technical characteristics of the new ARMPAC-607AP and ARMPAC-610AP in the following table:

Chassis material Engineering plastic
Screen size 7” 10.1”
Matrix type LCD TFT
Resolution 800 x 480 1280 x 800
Brightness, nits 400 350
Contrast 500~1
Touch screen type Capacitive
CPU i.MX8M Plus (Cortex A53) up to 1.6GHz
1x Micro SD slot
CAN 1x Pitch 3.5mm 2x 5-pin terminal block with 1x CAN bus 2.0b (CAN_H, CAN_L)
LAN 2xGbE LAN (LAN1 PoE as option)
COM 1x Pitch 3.5mm 2x 5-pin terminal block with 1x RS-232(RX,TX,RTS,CTS)/ 2W RS-484(D+, D-), selectable by jumper 1x 2Вт RS-485(D+,D-)
USB 1x USB 3.0/USB 2.0, type А
Power 24V DC
IP protection degree IP65 front
Dimensions (WxHxD), mm 150 x 204 x 46 269 x 189 x 49.5
Weight, kg 0.8 0.9
Mounting options Panel mounting, VESA 75
OS support Android 11, Yocto Linux 4.0 (Kirkstone)
Certificates CE/FCC Class A, UKCA, RoHS 2.0/REACH
Operational temperature, °C 0~50°C
Storage temperature, °C -30~70°C

In addition to the characteristics above, new products can be optionally equipped with 4G LTE and Wi-Fi/Bluetooth wireless modules.

The new compact models of panel computers ARMPAC-607AP and ARMPAC-610AP are unique solutions for use in machine learning and vision systems, multimedia and IoT devices, in industrial processes for object detection and recognition, etc. These are precisely the areas in which innovations directly affect and improve our way of life, including the transition to new levels of safety.

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