Efficiency, Performance, and Adaptability - the SolidRun Bedrock R7000 combines these criteria in a compact format. Its robust design, coupled with a powerful AMD Ryzen 7 CPU, makes this mini PC a highlight in the current embedded market.
Unique CPU Performance:
At the heart of the SolidRun Bedrock R7000 is the AMD Ryzen 7 7840HS CPU. With 8 Zen 4 cores, 16 threads, and speeds up to 5.1 GHz, it provides top-notch performance. The CPU also integrates a Radeon™ 780M GPU with 12 CUs and 2700 MHz.
Fanless Design for Quiet Operation:
The Bedrock R7000 operates completely without fans. The case itself serves as a heatsink, and multiple copper heat pipes distribute the processor's heat, ensuring efficient cooling even under extreme conditions. This allows for silent operation and an impressive temperature range from -40°C to 85°C.
Compact and Powerful:
The Bedrock R7000 industrial PCs are packed with cutting-edge technology, including a Radeon 780M GPU that controls 4 display outputs with 8K support, 64 GB DDR5 RAM, 3x NVME Gen4 2280, and more - all in a fanless case with less than 1 liter volume.
Innovative Cooling Technology:
The Bedrock R7000 utilizes liquid metal TIM for efficient heat dissipation. Stacked heat pipes distribute heat across the entire aluminum case. Additionally, specialized cooling fins support heat exchange and the chimney effect.
Modularity and Customization::
The modular structure of the Bedrock R7000 allows for flexible adaptation to various requirements. The subdivision into SoM, NIO, SX, and PM enables different combinations or the development of custom solutions.
Easy and Secure Integration:
Thanks to its robust design, front-facing I/O ports, and versatile mounting options, the Bedrock R7000 is easy to integrate. Its fanless design and high reliability make it ideal for harsh environments.
Conclusion:
The SolidRun Bedrock R7000 sets new standards in the realm of embedded PCs. With its powerful AMD Ryzen 7 CPU, innovative fanless design, and modular architecture, it offers an impressive blend of performance and flexibility for the embedded market.
