LEX SYSTEM has released a series of 2.5" 2I110D motherboards based on 11th Gen Tiger Lake-UP3 processors: Intel Core i7/i5/i3/Celeron. The 2I110D has Intel UHD Graphics integrated into the processor and supports up to 32 GB DDR4 RAM.
The 2I110D series includes the following models:
- 2I110D-EI7 - Intel Core i7-1185GRE
- 2I110D-EI5 - Intel Core i5-1145GRE
- 2I110D-EI3 - Intel Core i3-1115GRE
- 2I110D-EC0 - Intel Celeron 6305E
The main I/O interfaces are external 4 x GLAN and 3 x USB 3.0 Type A ports, as well as internal 6 x USB 2.0 and 2 x RS-232/422/485, eSPI. The board has 2 M.2 expansion slots: M.2 B key Type 3042 (PCIe x 2/USB 3.0/2.0) and M.2 M key Type 2242 (PCIe x 4/SATA) with NVMe support. There is also a Nano SIM slot.
The board’s small footprint (108 x 102 mm) and the capacity to operate in a wide temperature range from -40oC…+70oC (for Core i GRE) enable to build a versatile solution based on the 2I110D for ICS, IIoT, and much more.
The board supports Windows 10 IoT and Linux: Ubuntu 18.04.2, Fedora 29 and higher.
Basic characteristics of 2I110D motherboards:
Characteristic | Description |
---|---|
Processor | 11th Gen Tiger Lake-UP3: Intel Core i7/i5/i3/Celeron |
Chipset | Intel Tiger Lake-UP3 SoC |
RAM | 1 x DDR4 3,200 MHz SODIMM, up to 32 GB |
Video graphics | Intel UHD Graphics, DirectX 12 and OpenGL 4.5 support |
Video output | 1 x HDMI, eDP |
Storage | 1 x SATA 3.0 |
Expansion slots |
1 x M.2 B key Type 3042 (PCIe x 2/USB 3.0/2.0) 1 x M.2 M key Type 2242 (PCIe x 4/SATA) NVMe support 1 x Nano SIM |
I/O ports |
4 x GLAN 3 x USB 3.0 (Type A), 6 x USB 2.0 (internal) 2 x RS-232/422/485, eSPI 4 x DI, 4 x DO |
Dimensions | 2.5" or 108 x 102 mm |
Operating Temperature |
-40…+70 °C for Core i GRE -20…+70 °C for Core i G7E/G7 |
OS | Windows 10 IoT 64 bit, Ubuntu 18.04.2, Fedora 29 and higher |