ICOP Boards – The Perfect Choice for Upgrades

25 June 2025 Product Reviews

The PC/104 form factor, designed for compact and reliable embedded systems, remains in demand in industrial applications due to its modularity, vibration resistance, and expandability. One of the key features of PC/104 is its stackable architecture. This allows boards to be mounted on top of each other, forming a "stack." Each board in the stack can perform a specific function (e.g., processing, I/O, communication), and modules can be easily added or removed as needed. This modular approach simplifies system design, scaling, and maintenance.

PC/104 boards are originally designed for low-power operation, making them ideal for autonomous or battery-powered systems where energy efficiency is a priority. The primary manufacturers of PC/104 boards are concentrated in the USA and Taiwan, with each focusing on different market segments: legacy vendors specialize in ruggedized designs for harsh environments and wide temperature ranges; mid-tier manufacturers target the industrial segment with high-performance boards for data or video processing; and a number of niche suppliers focus on data acquisition and I/O solutions.

ICOP boards stand out in this segment for their combination of legacy support, energy efficiency, and specialized configurations for extreme conditions. ICOP has carved out a niche in cost-effective, highly reliable industrial solutions with low power consumption. This has been achieved by tailoring board configurations to specific applications, rather than pursuing a universal, high-cost, power-hungry platform designed to handle every task in a single configuration.

What Makes ICOP Boards Unique?

The core strength of ICOP boards lies in their legacy system compatibility. When it comes to upgrading an existing, operational system or ensuring guaranteed compatibility with an established project, ICOP is the clear choice. Vortex86 processors feature built-in ISA bus support and work seamlessly with legacy operating systems such as MS-DOS, Windows CE, Windows XP Embedded, and Linux.

This makes ICOP boards an ideal solution for modernizing legacy equipment—particularly when rewriting existing software is not economically viable, or when only a targeted hardware upgrade is required without overhauling the entire system architecture.

Broadly speaking, the ICOP product line can be divided into two major categories:

  • Vortex86-Based Solutions (e.g., VDX3-6755-2C-2G ) represent a family of x86-compatible System-on-Chip (SoC) processors developed by DMP Electronics, a subsidiary of ICOP. These chips integrate the CPU, GPU, chipset, and a wide range of peripheral controllers (COM, LPT, IDE, Ethernet, etc.) into a single silicon die. Featuring built-in ISA bus support, they offer low power consumption, wide operating temperature tolerance from -40°C to +85°C, and compatibility with legacy interfaces such as ISA and RS-232/485. This makes them particularly well-suited for upgrading industrial systems where replacing the existing infrastructure is not feasible. These processors are ideal for applications where computational performance is not the priority, but stability, reliability, and efficiency are critical.
  • Intel/AMD-Based Solutions (e.g., IBW-6954 ) combine a proven, highly reliable form factor with modern processing power — that’s their key differentiator. Unlike the low-clock, single-core Vortex86 processors, these platforms utilize Intel Atom®, Intel® Celeron®, Intel® Core™ i3/i5/i7, and AMD Ryzen™ Embedded CPUs. As a result, they support modern operating systems with graphical interfaces, enable multithreaded data processing, and can run resource-intensive software applications.

Another major advantage of ICOP boards with Intel/AMD processors is access to modern interfaces. These platforms support DDR3L or DDR4 SODIMM memory (instead of soldered DDR2/DDR3 on Vortex86 boards), video outputs such as DisplayPort, HDMI, and LVDS with Full HD and 4K resolution support, and SATA III (6 Gb/s) connections for SSD/HDD storage. Additionally, they include mSATA or M.2 slots for compact storage solutions.

ICOP Intel/AMD boards also feature one or two Gigabit Ethernet ports (compared to 10/100 Mbps) and USB 3.0/3.1, which are essential for high-speed cameras, external storage, and other bandwidth-intensive peripherals.

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Key ICOP Products and Their Applications

VDX3-6726 is the most advanced and powerful model in ICOP’s "classic" PC/104 product line. It is designed for new projects that do not require extreme processing power but demand enhanced system stability. This board is widely adopted in general industrial automation, transportation systems, medical device manufacturing, and HMI panel production. It performs exceptionally well as the central processing unit of a modular controller, where it is stacked with I/O, CAN, and other interface boards. It is often used to manage the logic of small machines or process units.

Key features of the VDX3-6726 include:

  • Processor: Vortex86DX3 (1 GHz) — the most powerful processor in the DX family
  • Bus: 16-bit ISA bus ensuring full legacy compatibility
  • Memory: Supports up to 2 GB DDR3
  • Interfaces: SATA for modern storage devices, 2x Ethernet, 4x COM, 4x USB 2.0
  • Power Consumption: Extremely low (~5 W), ideal for fanless systems

The VSX-6154-V2 is a highly cost-effective board specifically designed for legacy system upgrades. It offers ultra-low power consumption, minimal cost, and maximum compatibility with even the oldest systems. The board includes only the essential set of interfaces — 1x LAN, COM ports, USB, and IDE — which contributes to overall reliability by reducing complexity.

Its primary use cases include modernizing legacy equipment, autonomous data loggers, and basic embedded controllers. The board is capable of operating for months on battery power in remote locations, collecting sensor data or controlling devices like barriers or pump stations, where only basic control logic is required.

Key features of the VSX-6154-V2:

  • Processor: Vortex86SX (300 MHz) — even simpler and more energy-efficient than the DX line, ideal for running DOS-based systems
  • Bus : 16-bit ISA bus for full legacy compatibility
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The VDX3-6754 board supports both ISA and PCI buses, making it a true bridge between legacy and modern peripheral ecosystems. It features an x86-compatible architecture, meaning it can run software originally developed for standard PCs. At the same time, it retains a standard PC/104 connector, providing access to the 16-bit ISA bus — a critical feature for many industrial applications.

This enables the board to interface with legacy expansion cards (such as ADCs, DACs, or proprietary hardware controllers) that are no longer in production but still essential to existing industrial operations.

Key Specifications:

  • Processor: Vortex86DX3 (1 GHz, dual-core) — Low power consumption with x86 compatibility
  • Memory: 1 GB / 2 GB soldered DDR3 — High reliability and vibration resistance
  • Legacy Bus: PC/104 (ISA) — Core advantage for system upgrades
  • COM Ports: RS-232, RS-422/485 — Industrial communication backbone
  • Power Supply : +5V DC — Simplified integration

Why Choose ICOP?

ICOP guarantees long-term product availability for 10 to 15 years, which is a critical factor for infrastructure and industrial projects. Even for small project-specific production runs, the company offers free customization of I/O panels to meet client requirements. In addition, ready-to-use drivers for QNX, VxWorks, and Linux RT significantly simplify the integration of real-time systems for engineers.

Overall, ICOP’s PC/104 and SBC olutions stand out as ultra-reliable industrial computers, designed for long-term deployment in harsh operating environments. Their key differentiator is the use of proprietary energy-efficient Vortex86 processors, which offer deep legacy compatibility (ISA bus, support for older operating systems), making them ideal for upgrading legacy equipment.

At the same time, for modern, performance-demanding applications, ICOP also provides Intel/AMD-based product lines, delivering high computing power in the same compact, ruggedized, and vibration-resistant industrial form factors.

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