ICP DAS PAC I/O (Programmable Automation Controller Input/Output) modules are core components in modern industrial automation systems. They handle sensor data acquisition, actuator control, and communication between field-level devices and supervisory systems (SCADA/MES).
Key features include:
- Robust Reliability: Operation in extreme conditions (-40°C to +85°C, vibration, EMI).
- Configuration Flexibility: Diverse interfaces (Ethernet, USB, RS-485) and signal types (DI/DO, AI/AO, RTD, Thermocouple).
- Modularity: Scalable architecture for system expansion.
- Industrial Protocol Support: Modbus TCP/RTU, CANopen, PROFINET (model-dependent).
Primary applications: Process parameter monitoring (temperature/pressure/flow), production line control, building management systems (HVAC/power), and smart infrastructure.
PAC I/O Series Overview
1. e-9K Series: Compact USB/Ethernet Modules (Available soon for sale)
Ideal for local data acquisition and PC integration. Features tool-free installation.
- e-9K Modules by ICP-DAS e-USB400 by ICP DAS: 4-channel USB analog input module (0-10V, ±10V, 0-20mA).
- e-9K Modules by ICP-DAS e-D96S by ICP DAS: 96-channel digital I/O module with 10/100 Ethernet and Modbus TCP.
Application: Lab test benches, mobile monitoring systems, PC-based DAQ.
2. I-9K/I-97K Series: Industrial Ethernet Modules
Distributed Ethernet-based systems. Supports PoE and -40°C to +75°C operation.
- ICP-DAS I-9K Parallel Bus Modules I-9014 by ICP DAS: 4-channel analog input (TC/RTD/mV/V/mA) with Ethernet.
- ICP-DAS I-9K Parallel Bus Modules I-9053P by ICP DAS: 8 DI (dry contact) + 8 DO (transistor 0.5A) with PoE.
- ICP-DAS i-8K Parallel bus Extension Modules I-8014CW by ICP DAS: 4-channel isolated analog output (0-20mA/0-10V) with overload protection.
- ICP-DAS i-8K Parallel bus Extension Modules I-8041PW by ICP DAS: 16 DI (voltage/current sink) + 8 DO (relay 3A).
- ICP-DAS i-8K Parallel bus Extension Modules I-8017H-G by ICP DAS: 8-channel high-resolution analog input (±150mV to ±10V/±20mA).
- I/O Expansion Boards (XV/XW-Boards) by ICP-DAS XV107 by ICP DAS: 32 DI (dry contact/voltage) + 32 DO (transistor).
- I/O Expansion Boards (XV/XW-Boards) by ICP-DAS XV484 by ICP DAS: 8 AI (RTD) + 8 AO (0-20mA/0-10V).
Application: SCADA remote stations, facility monitoring, PLC peripheral expansion.
3. I-8K/I-87K Series (High Profile): DIN-Rail Modules
Standard DIN-rail mounting for control cabinets. Dual-watchdog design.
Application: Machine automation, pump/valve control, alarm systems.
4. I-8K/I-87K Series (Low Profile): Slim DIN-Rail Modules
Space-optimized for compact enclosures (22.5mm width).
Application: Retrofitting legacy systems, embedded control, tight-panel installations.
5. XV-board Series: High-Density Isolation Modules
Maximum channel density (up to 64 I/O) with 3 kV isolation.
Application: High-channel-count systems (power/water treatment).
6. XB-board Series: CANopen Distributed I/O (Available soon for sale)
Certified CANopen EN 50325-4 compliance.
- I/O Expansion Boards (XV/XW-Boards) by ICP-DAS XB310 by ICP DAS: 8 DI + 8 DO (transistor) with CANopen.
Application: Vehicle systems, CAN-based machinery, motion control.
7. XW-board Series: Extended-Temperature Modules
Operates at -40°C to +85°C with conformal coating.
- I/O Expansion Boards (XV/XW-Boards) by ICP-DAS XW107 by ICP DAS: 32 DI + 32 DO (transistor).
- I/O Expansion Boards (XV/XW-Boards) by ICP-DAS XW506 by ICP DAS: 8 AI (TC/mV/V/mA) + 8 AO.
Application: Oil/gas, outdoor substations, metal processing.
8. X-board Series: Cost-Effective I/O
Entry-level solutions with 3 kV isolation.
- I/O X Series Expansion Boards X000 by ICP DAS: 32 DI (dry contact).
- I/O X Series Expansion Boards X501 by ICP DAS: 8 AI + 8 AO.
Application: Budget automation, educational setups, simple monitoring.
9. GTP Expansion Boards (Phased out)
Backplane-compatible with GTP-series PLCs.
- Cellular GSM / GPRS Modems GTP-X301 by ICP DAS: RS-232/422/485 + CAN 2.0B + 8 DI.
Application: GTP PLC communication/DI expansion.
10. AI Accelerator Modules (Available soon for sale)
Edge AI processing with M.2 form factor.
- Cellular GSM / GPRS Modems Hailo-8L-M2 by ICP DAS: 13 TOPS neural accelerator.
Application: Embedded vision, predictive maintenance, edge inference.
Conclusion
ICP DAS PAC I/O modules deliver scalable solutions for industrial automation—from basic data logging to AI-enhanced distributed control. Selection criteria: signal type/density, environmental rating, network protocols, and integration requirements.
