Innodisk has introduced new models of DDR4 and DDR5 RAM, characterized by increased resistance to high and low temperatures. To achieve such results, Innodisk modified the technical process and used reinforced gold connections, which in turn increased the thickness of the Gold Finger from 30 microns to 45. To eliminate the appearance of microcracks in the soldering, the microcircuits are additionally attached to a heat-resistant compound. And to prevent corrosion of gold and silver contacts, an additional protective layer was added. These new products are used in solutions for designing vehicles, surveillance and automation systems.
| DDR4 | DDR5 | |
|---|---|---|
| Module type | Ultra Temperature ECC SODIMM | Ultra Temperature SODIMM |
| Bandwidth | 2133/2400/2666/2933/3200 MT/s | 4800 MT/s |
| Density | 16/32 GB | 8/16 GB |
| ЕСС | Yes | No |
| Pin number | 260-pin | 262-pin |
| Bus width | 72 bit | 64 bit |
| Voltage | 1,2V | 1,1V |
| PCB height | 1,18 inches | |
| Operating temperature | –40°C to +125°C | –40°C to +105°C |
| Anti-sulfuration | Yes | |
| Gold Finger | 45μ” | |
| Standards | JEDEC | |
| Certificates | RoHS, CE/FCC | |
