In modern industrial automation, the approach to system design is increasingly based on the principle of modularity. ARBOR presented its vision of this concept: the EmNANO-iX701 CPU module, designed in the COM Express Mini Type 10 form factor. It's important to understand that this isn't a standalone computer, but a computing core installed on a carrier board. This combination allows engineers to flexibly manage the final system dimensions: from extremely compact controllers to large control panels with a multitude of specialized interfaces.
Technical basis and computing power
The module is based on the Intel Amston Lake architecture and supports Atom x7000RE series processors.
There are two configurations available:
- EmNANO-iX701-WT-x7211RE-4G – Atom x7211RE: a dual-core chip with a clock speed of 1.3 GHz and an extremely low TDP of 6 watts..
- EmNANO-iX701-WT-x7433RE-8G – Atom x7433RE: a quad-core version with a frequency of 1.5 GHz and a TDP of 9 W.
It should be noted that the new model provides support for Intel TCC and TSN technologies. For specialists, this means the ability to work in hard real-time mode, which is critical for synchronizing sensors and actuators in robotics or complex production lines.
RAM and expansion interfaces
To ensure stable operation under constant vibration, up to 16 GB of LPDDR5 RAM is soldered directly onto the module. This eliminates the risk of lost contact in the slots, which often occurs in mobile or high-load industrial systems.
Despite the module's auxiliary role, it comes with a rich selection of communication interfaces, which are transmitted to the main board via a standardized connector:
- Networking: The integrated Intel i226 controller supports speeds up to 2.5 Gbps.
- Graphics: The Intel Gen12 UHD core supports dual independent displays via a DDI port and single-channel LVDS.
- Expansion Buses: Four PCIe x1 lanes are available, along with LPC, I2C, and SMBus interfaces for connecting to low-speed peripherals on the carrier board.
- Storage: In addition to two SATA 3.0 ports, an eMMC 5.1 drive can be installed factory-installed.
Working conditions
The module is designed to operate in harsh temperature conditions—from minus 40 to plus 85 degrees Celsius. However, when designing the final device, engineers should keep in mind that the specification requires the use of an additional heatsink when the upper temperature limit is reached.
The module's power supply is universal and supports automatic voltage detection of 5V or 12V.
Conclusion
Choosing the EmNANO-iX701 as the basis for a new device significantly optimizes the development process. The module handles the key tasks of ensuring stable communication between the CPU and RAM and managing high-speed interfaces. Essentially, you get a tested and predictable foundation that guarantees the correct operation of the entire computing component.
For a system integrator, this means the ability to focus on application-specific tasks. You can devote maximum attention to carrier board design: the placement of the necessary physical connectors, the selection of peripherals, and project-specific controllers. As a result, this combination of a ready-made platform with real-time support and your custom design allows you to create a reliable industrial solution with minimal technical debugging costs.
