ADLINK is preparing to manufacture COM-HPC Client Type and COM Express Type 6 processor boards with an integrated 12th generation Intel Core processor. ADLINK processor boards together with Alder Lake-H generation Intel Core CPUs allow you to create a unique solution with high performance in both single-threaded and multi-threaded modes, and the compact size of the board allows you to use the solution not only in stationary, but also in mobile environments.
ADLINK boards with Intel Alder Lake-H are built with PCIe 4.0 bus and up to 4800MT/s DDR5 RAM with increased cache. The boards also have advanced security and management features, improved graphics, and ample opportunities for connecting peripherals and working with AI.
Intel Iris Xe integrated graphics with support for 96 EU units allows you to simultaneously connect up to 4 4K60 HDR monitors via DDI, eDP 1.4b, USB 4 or Thunderbolt 4, while Intel Deep Learning Boost technology provides high performance in AI solutions.
ADLINK expects system integrators to use Intel Alder Lake-H CPU boards to build high-performance IoT solutions across a wide range of applications, including test and measurement, industrial edge servers, machine vision, and robotics.
Key features of COM-HPC and COM Express Type 6 CPU boards:
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| Model name | Express-ADP | COM-HPC-cADP |
| Form factor | COM Express Type 6 | COM-HPC Client Type Size B |
| CPU |
12th Gen Intel Core Alder Lake-H Up to 14 cores (6 P-cores and 8 E-cores), 20 threads |
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| AI support | Intel AVX-512 VNNI, Intel DL Boost | |
| Video graphics | Intel Iris Xe, 4x 4K displays, DDI slots, eDP 1.4b, USB4 and TBT4 | |
| RAM | Up to 64GB DDR5, up to 4800MT/s | |
| Expansion slots |
16x PCIe Gen4 5x PCIe Gen3 |
16x PCIe Gen4 8x PCIe Gen3 |
| I/O ports |
2.5GbE, TSN support 4x USB 3.x/2.0 4x USB 2.0 |
2.5GbE NBASE-T (0.1) 2x USB 4/3.x/2.0 2x USB 3.x/2.0 4x USB 2.0 |
| Storage | NVMe SSD support 2x SATA | NVMe SSD support |
| Power requirements | 8.5 V to 20 V | |
