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04:24 07.05.2020
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+49 511 807 259-0, sales@ipc2u.com

SLP-SKLB-1702-A1R

Embeded Expandable Fanless PC, Intel Core i5-6500TE CPU, Q170 Chipset, Up to 32GB DDR4 2133MHz (4GB Default), DP, DVI-I, 2xGbit LAN, 6xUSB 3.0, 4xCOM, 2x2.5" Drive Bay (RAID 0,1), mSATA, cFast, 16bit GPIO, 1xPCIe x8, 2xPCIe x4, PCI, 9-36V DC-In

Price on request ()
Construction Chassis:
Metal Chassis with Aluminium Heatsink
Processor Supported:
Intel Celeron, Intel Core i3, Intel Core i5, Intel Core i7
Processor Installed:
Intel Core i5-6500TE
Operating System Compatibility:
Linux OS, Windows 8.1, Windows 10
Temperature:
0 ... 55 °C
Specification
Vendor
Name:
Avalue
Construction
Construction Chassis:
Metal Chassis with Aluminium Heatsink
CPU
Processor Supported:
Intel Celeron, Intel Core i3, Intel Core i5, Intel Core i7
Processor Installed:
Intel Core i5-6500TE
Chipset
Chipset:
Intel Q170
Memory
Memory Type:
DDR4 2133
Default on Board Memory:
4 GB
Maximum Memory:
32 GB
Network Adapter
Total Ethernet:
2
10/100/1000 Mbit/s:
2
Interfaces
COM Total:
4
RS-232:
2
RS-232/422/485:
2
USB Total:
6
USB 3.0:
6
Digital Input-Output
GPIO:
8xDigital In / 8xDigital Out
Storage
2.5" Drive Bays:
SSD, HDD
Quantity of HDD:
2
mSATA Support:
Yes
CFast Socket:
Yes
Extension Slots
PCI Express x4:
2
PCI Express x8:
1
PCI:
1
Connectors / Cables
Connectors:
4xDB9, DVI-I, PS/2 Keyboard/Mouse, 2xRJ45 Ethernet, 6xUSB, Mic In, Line Out, Display Port
System Power Input
Input Voltage DC:
9 ... 36 V
Software
Operating System Compatibility:
Linux OS, Windows 8.1, Windows 10
Dimensions and weight
Width:
92 mm
Height:
217.8 mm
Depth:
220 mm
Operating Conditions
Temperature:
0 ... 55 °C
Humidity:
0 ... 90 %
Vibration:
IEC 60068-2-64 Test:Fh 1.5Grms, X, Y, and Z axis, 30 minutes per axis
Shock:
Bump test, 10Grms/11ms
Standards and Certifications
Certifications:
CE, FCC
Description of goods

SLP-SKLB-1702-A1R Fanless Expandable Embedded System introduces Intel Core i3 / i5 / i7, up to 32GB of DDR4 RAM, 4xExpansion slots, 2xDrive Bay, 6xUSB, 4xCOM

With an Intel Core i3 / i5 / i7 processor and up to 32 GB expandable DDR4 RAM, the SLP-SKLB-1702-A1R is a powerful and universally applicable industrial embedded system. For a flexible customization of the expandable platform, it has a high number of native interfaces and combines these with numerous expansion ports in the PCI 32-bit and PCI Express standards.

The Fanless industry computer uses a LGA1151 for the Intel Core i3/i5/i7 CPU of the 6th generation Skylake, which have a high scalability and an excellent balance between energy consumption and performance. The basic version uses an Intel Core i5-6500TE Quad Core processor with a clock speed of 2.30 GHz as the basis and up to 3.30 GHz in Turbo Boost mode. The 4 GB DDR4 RAM consists of two SO-DIMM non-ECC memory banks, which allow fast access via dual channel and a maximum capacity of 32 GB of RAM. With two drive bays for 2.5 "SSD / HDD and integrated hardware RAID 0.1, the SLP-SKLB-1702-A1R is flexible in the choice of storage media and allows optimization of capacity, transfer rate or security via mirroring on two independent drives ,

In order to be able to offer the user a universal selection of interfaces and to keep the extension slots available for a specific customization, the Industrial Embedded Platform offers a wide range of native interfaces. These include six USB 3.0 ports and two serial COM ports each in RS232 and RS232 / 422/485 for peripheral hardware. Direct communication with sensors and actuators is handled by the Expandable System SLP-SKLB-1702-A1R via an electrically isolated 16-bit GPIO with 8 channels each for DI and DO. For an expansion of the interfaces, a total of four expansion ports are available in PCI Express x8, dual PCI-e x4 and 32-bit legacy PCI. Through RJ45 Dual LAN with two Base TX GbE controllers, the industrial computer integrates into multiple physical subnets or into redundant IT networks such as ring-shaped structures.

For operation in difficult conditions and a maintenance-free operation 24/7/365 with high reliability, the industrial platform uses a fanless design. It allows use in a wide temperature range from 0 ° Celsius to 50 ° Celsius and, when using SSD, provides a high tolerance of 10 Grms for mechanical shocks. To provide access to external ports of the expansion ports, the backplane is customizable via individual panels. Applications of the SLP-SKLB-1702-A1R include industrial automation such as in production or facility management, virtualization of existing systems for hardware optimization and technical or mechanical process management with high performance.

Dimensions

Weight

weight brutto: 4.5 kg
weight netto: 4.5 kg
https://ipc2u.com:443/catalog/slp-sklb-1702-a1r
04:24 07.05.2020