R12FA3S-GCM2
Winmate
SKU: 07676200
Fanless Panel Computer 12.1" TFT LCD, 1024x768, projected capacitive touch, Freescale Cortex A9 iMX6 Dual Core 1.0GHz, 1GB RAM, 64GB eMMC, IP65 Front, 9...24VDC-in, OS: Android 4.4
Price on request
Available on order
Available on order
Construction
Construction Chassis
Metal Chassis
Mounting Configuration
Panel, Wall VESA 75
Protection Level of Front Side (Panel)
IP65
Type
Fanless
Display
Display Type
LCD TFT
Diagonal
12.1 "
Maximum resolution
1024x768 Dots
Aspect Ratio
4:3
Brightness
700 Cd/m2
Contrast Ratio
500~1
Touch Screen
Touch Screen Type
Capacitive
CPU
Processor Installed
NXP i.MX6 dual-core
Socket
CPU onboard
Max CPU frequency
1 GHz
Memory
Form-factor
DDR3
Socket Type
Soldered
Default on Board Memory
1 GB
Assembly
Fixed on Board
Ethernet
Total Ethernet
1
10/100/1000 Mbit/s
1
Interfaces
COM Total
2
RS-232/422/485
2
USB Total
1
USB 2.0
1
Drive interfaces
MicroSD
1
LED / Controls
Controls
Control Buttons
Connectors
Connectors
2xDB9, RJ45 Ethernet, DC Input, MicroSD card slot, USB type A
System Power Input
Input Voltage DC
12..12 V
Software
Operating System Installed
Android
Dimensions and weight
Width
252.4 mm
Height
198 mm
Depth
36.4 mm
Operating Conditions
Operating Temperature
-10..55 °C
Vibration
2.18 g rms for XYZ/ 5-500Hz
Shock
30g for 18ms
Standards and Certifications
Certifications
CE, FCC
Dimensions
Net Weight
4 kg
Gross Weight
5 kg
Construction
Construction Chassis
Metal Chassis
Mounting Configuration
Panel, Wall VESA 75
Protection Level of Front Side (Panel)
IP65
Type
Fanless
Display
Display Type
LCD TFT
Diagonal
12.1 "
Maximum resolution
1024x768 Dots
Aspect Ratio
4:3
Brightness
700 Cd/m2
Contrast Ratio
500~1
Touch Screen
Touch Screen Type
Capacitive
CPU
Processor Installed
NXP i.MX6 dual-core
Socket
CPU onboard
Max CPU frequency
1 GHz
Memory
Form-factor
DDR3
Socket Type
Soldered
Default on Board Memory
1 GB
Assembly
Fixed on Board
Ethernet
Total Ethernet
1
10/100/1000 Mbit/s
1
Interfaces
COM Total
2
RS-232/422/485
2
USB Total
1
USB 2.0
1
Drive interfaces
MicroSD
1
LED / Controls
Controls
Control Buttons
Connectors
Connectors
2xDB9, RJ45 Ethernet, DC Input, MicroSD card slot, USB type A
System Power Input
Input Voltage DC
12..12 V
Software
Operating System Installed
Android
Dimensions and weight
Width
252.4 mm
Height
198 mm
Depth
36.4 mm
Operating Conditions
Operating Temperature
-10..55 °C
Vibration
2.18 g rms for XYZ/ 5-500Hz
Shock
30g for 18ms
Standards and Certifications
Certifications
CE, FCC
Dimensions
Net Weight
4 kg
Gross Weight
5 kg
Construction
Construction Chassis
Metal Chassis
Mounting Configuration
Panel, Wall VESA 75
Protection Level of Front Side (Panel)
IP65
Type
Fanless
Display
Display Type
LCD TFT
Diagonal
12.1 "
Maximum resolution
1024x768 Dots
Aspect Ratio
4:3
Brightness
700 Cd/m2
Contrast Ratio
500~1
Touch Screen
Touch Screen Type
Capacitive
CPU
Processor Installed
NXP i.MX6 dual-core
Socket
CPU onboard
Max CPU frequency
1 GHz
Memory
Form-factor
DDR3
Socket Type
Soldered
Default on Board Memory
1 GB
Assembly
Fixed on Board
Ethernet
Total Ethernet
1
10/100/1000 Mbit/s
1
Interfaces
COM Total
2
RS-232/422/485
2
USB Total
1
USB 2.0
1
Drive interfaces
MicroSD
1
LED / Controls
Controls
Control Buttons
Connectors
Connectors
2xDB9, RJ45 Ethernet, DC Input, MicroSD card slot, USB type A
System Power Input
Input Voltage DC
12..12 V
Software
Operating System Installed
Android
Dimensions and weight
Width
252.4 mm
Height
198 mm
Depth
36.4 mm
Operating Conditions
Operating Temperature
-10..55 °C
Vibration
2.18 g rms for XYZ/ 5-500Hz
Shock
30g for 18ms
Standards and Certifications
Certifications
CE, FCC
Dimensions
Net Weight
4 kg
Gross Weight
5 kg
Construction
Construction Chassis
Metal Chassis
Mounting Configuration
Panel, Wall VESA 75
Protection Level of Front Side (Panel)
IP65
Type
Fanless
Display
Display Type
LCD TFT
Diagonal
12.1 "
Maximum resolution
1024x768 Dots
Aspect Ratio
4:3
Brightness
700 Cd/m2
Contrast Ratio
500~1
Touch Screen
Touch Screen Type
Capacitive
CPU
Processor Installed
NXP i.MX6 dual-core
Socket
CPU onboard
Max CPU frequency
1 GHz
Memory
Form-factor
DDR3
Socket Type
Soldered
Default on Board Memory
1 GB
Assembly
Fixed on Board
Ethernet
Total Ethernet
1
10/100/1000 Mbit/s
1
Interfaces
COM Total
2
RS-232/422/485
2
USB Total
1
USB 2.0
1
Drive interfaces
MicroSD
1
LED / Controls
Controls
Control Buttons
Connectors
Connectors
2xDB9, RJ45 Ethernet, DC Input, MicroSD card slot, USB type A
System Power Input
Input Voltage DC
12..12 V
Software
Operating System Installed
Android
Dimensions and weight
Width
252.4 mm
Height
198 mm
Depth
36.4 mm
Operating Conditions
Operating Temperature
-10..55 °C
Vibration
2.18 g rms for XYZ/ 5-500Hz
Shock
30g for 18ms
Standards and Certifications
Certifications
CE, FCC
Dimensions
Net Weight
4 kg
Gross Weight
5 kg
Documentation
Documentation
Documentation
Documentation
