Industry standard scalable and robust input/output solutions for distributed automation systems makes ICP DAS Remote I/O devices an outstanding choice. This listing shows units that provide where centralized wiring is impractical or inefficient. Designed for use in harsh industrial environments, these modules support a wide range of analog, digital, and mixed-signal I/O functions and enable reliable data acquisition and control across remote locations.
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The product range includes modular and standalone units that connect to control systems via common industrial protocols such as Modbus RTU/TCP, CANopen, EtherCAT, EtherNet/IP, PROFIBUS, and MQTT. These devices facilitate seamless integration with PLCs, SCADA systems, PACs, and cloud-based platforms, supporting both legacy and modern control architectures.
All modules for sale here are available with various combinations of digital input/output, analog input/output, pulse counting, thermocouple, RTD, load cell, and strain gauge interfaces. Built-in signal conditioning, channel-to-channel isolation, and support for high-resolution ADCs/DACs ensure accurate and reliable measurement in demanding applications such as power monitoring, water treatment, process control, and facility automation.
Some of the models feature dual Ethernet ports for daisy-chain topology, built-in web servers for remote configuration, and data logging capabilities. Others support peer-to-peer communication or intelligent logic execution at the edge, reducing dependency on central control units. Most devices support wide input voltage ranges, overvoltage protection, and extended temperature operation from -25°C to +75°C or beyond.
Inlcuded are compact DIN-rail or wall-mountable enclosures, LED status indicators, and hot-swappable designs enhance maintainability and system uptime. Combined with modular wiring options and protocol interoperability, these remote I/O modules enable efficient expansion of monitoring and control points across widely distributed sites.
You can easily sort by I/O type, signal specification, number of channels, communication interface, isolation voltage, or form factor to match the device to your application’s physical and technical requirements.