FM12Q-V

Winmate
SKU: 57630200
12.1" Vehicle Fanless Panel PC, IP65, 1024x768, P-CAP Touch, Qualcomm Snapdragon 660 2.2GHz SoC, 3GB RAM, 32GB eMMC, WiFi/BT, 2MP Cam., 1xGbE LAN, 1xUSB 3.0 Type-C, 1xUSB 2.0, 2xCOM, 1xSIM, 1xMicroSD, Audio, Android 9, 10-60VDC-in w/ PSU, -30..50C
Price on request
Available on order
Available on order
Construction
Construction Chassis
Magnesium Alloy
Mounting Configuration
Wall VESA 100, Wall VESA 75
Protection Level of Chassis
IP65
Type
Fanless
Display
Display Type
LCD TFT
Diagonal
12.1 "
Maximum resolution
1024x768 Dots
Aspect Ratio
4:3
Brightness
400 Cd/m2
Contrast Ratio
1000~1
Touch Screen
Touch Screen Type
Capacitive
CPU
Processor Installed
Qualcomm Snapdragon 660
Socket
CPU onboard
Max CPU frequency
2.2 GHz
Chipset
Chipset
SoC
Memory
Socket Type
Soldered
ECC
No
Default on Board Memory
3 GB
Assembly
Fixed on Board
Graphic
Graphic Controller
Integrated in CPU
Ethernet
Total Ethernet
1
10/100/1000 Mbit/s
1
Wi-Fi
Wi-Fi Standard
Yes
Interfaces
COM Total
2
RS-232/422/485
2
USB Total
2
USB 2.0
1
USB v3.x
1
Digital Input-Output
Channels of DIO
4
Drive interfaces
MicroSD
1
Installed drive
Drive Type
SSD
Storage Form-Factor
eMMC
1st Storage Capacity
32 GB
Extension Slots
SIM Card slots
Yes, 2, Nano SIM
Antenna characteristics
Cellular interfaces
4G (Optional)
Additional Functions
GPS
Optional
LED / Controls
LED
Battеry Status, WLAN LED
Controls
On/Off, Function Keys
Connectors
Connectors
2xDB9, RJ45 Ethernet, 1xUSB, DC Input, SIM Card Slot, SD card slot, USB type C
System Power Input
Input Voltage DC
10..60 V
Power Supply
Type of Power Supply
External power adapter AC/DC
Output Power
84 W
Software
Operating System Installed
Android
Dimensions and weight
Width
307 mm
Height
225 mm
Depth
57 mm
Operating Conditions
Operating Temperature
-30..60 °C
Humidity
5-95%
Vibration
MIL-­STD­-810H Method 514.8 Procedure I
Shock
MIL­-STD­-810H Method 516.8 Procedure I
Standards and Certifications
Certifications
CE/FCC
EMS
EN 61000-4-2
MIL-STD-810
MIL-STD-810H Test Method 516.8 Shock, MIL-STD-810H Test Method 514.8 Vibration
Vandal Resistance
EN 62262, IK07 level
Dimensions
Net Weight
2.5 kg
Gross Weight
3.2 kg
Construction
Construction Chassis
Magnesium Alloy
Mounting Configuration
Wall VESA 100, Wall VESA 75
Protection Level of Chassis
IP65
Type
Fanless
Display
Display Type
LCD TFT
Diagonal
12.1 "
Maximum resolution
1024x768 Dots
Aspect Ratio
4:3
Brightness
400 Cd/m2
Contrast Ratio
1000~1
Touch Screen
Touch Screen Type
Capacitive
CPU
Processor Installed
Qualcomm Snapdragon 660
Socket
CPU onboard
Max CPU frequency
2.2 GHz
Chipset
Chipset
SoC
Memory
Socket Type
Soldered
ECC
No
Default on Board Memory
3 GB
Assembly
Fixed on Board
Graphic
Graphic Controller
Integrated in CPU
Ethernet
Total Ethernet
1
10/100/1000 Mbit/s
1
Wi-Fi
Wi-Fi Standard
Yes
Interfaces
COM Total
2
RS-232/422/485
2
USB Total
2
USB 2.0
1
USB v3.x
1
Digital Input-Output
Channels of DIO
4
Drive interfaces
MicroSD
1
Installed drive
Drive Type
SSD
Storage Form-Factor
eMMC
1st Storage Capacity
32 GB
Extension Slots
SIM Card slots
Yes, 2, Nano SIM
Antenna characteristics
Cellular interfaces
4G (Optional)
Additional Functions
GPS
Optional
LED / Controls
LED
Battеry Status, WLAN LED
Controls
On/Off, Function Keys
Connectors
Connectors
2xDB9, RJ45 Ethernet, 1xUSB, DC Input, SIM Card Slot, SD card slot, USB type C
System Power Input
Input Voltage DC
10..60 V
Power Supply
Type of Power Supply
External power adapter AC/DC
Output Power
84 W
Software
Operating System Installed
Android
Dimensions and weight
Width
307 mm
Height
225 mm
Depth
57 mm
Operating Conditions
Operating Temperature
-30..60 °C
Humidity
5-95%
Vibration
MIL-­STD­-810H Method 514.8 Procedure I
Shock
MIL­-STD­-810H Method 516.8 Procedure I
Standards and Certifications
Certifications
CE/FCC
EMS
EN 61000-4-2
MIL-STD-810
MIL-STD-810H Test Method 516.8 Shock, MIL-STD-810H Test Method 514.8 Vibration
Vandal Resistance
EN 62262, IK07 level
Dimensions
Net Weight
2.5 kg
Gross Weight
3.2 kg
Construction
Construction Chassis
Magnesium Alloy
Mounting Configuration
Wall VESA 100, Wall VESA 75
Protection Level of Chassis
IP65
Type
Fanless
Display
Display Type
LCD TFT
Diagonal
12.1 "
Maximum resolution
1024x768 Dots
Aspect Ratio
4:3
Brightness
400 Cd/m2
Contrast Ratio
1000~1
Touch Screen
Touch Screen Type
Capacitive
CPU
Processor Installed
Qualcomm Snapdragon 660
Socket
CPU onboard
Max CPU frequency
2.2 GHz
Chipset
Chipset
SoC
Memory
Socket Type
Soldered
ECC
No
Default on Board Memory
3 GB
Assembly
Fixed on Board
Graphic
Graphic Controller
Integrated in CPU
Ethernet
Total Ethernet
1
10/100/1000 Mbit/s
1
Wi-Fi
Wi-Fi Standard
Yes
Interfaces
COM Total
2
RS-232/422/485
2
USB Total
2
USB 2.0
1
USB v3.x
1
Digital Input-Output
Channels of DIO
4
Drive interfaces
MicroSD
1
Installed drive
Drive Type
SSD
Storage Form-Factor
eMMC
1st Storage Capacity
32 GB
Extension Slots
SIM Card slots
Yes, 2, Nano SIM
Antenna characteristics
Cellular interfaces
4G (Optional)
Additional Functions
GPS
Optional
LED / Controls
LED
Battеry Status, WLAN LED
Controls
On/Off, Function Keys
Connectors
Connectors
2xDB9, RJ45 Ethernet, 1xUSB, DC Input, SIM Card Slot, SD card slot, USB type C
System Power Input
Input Voltage DC
10..60 V
Power Supply
Type of Power Supply
External power adapter AC/DC
Output Power
84 W
Software
Operating System Installed
Android
Dimensions and weight
Width
307 mm
Height
225 mm
Depth
57 mm
Operating Conditions
Operating Temperature
-30..60 °C
Humidity
5-95%
Vibration
MIL-­STD­-810H Method 514.8 Procedure I
Shock
MIL­-STD­-810H Method 516.8 Procedure I
Standards and Certifications
Certifications
CE/FCC
EMS
EN 61000-4-2
MIL-STD-810
MIL-STD-810H Test Method 516.8 Shock, MIL-STD-810H Test Method 514.8 Vibration
Vandal Resistance
EN 62262, IK07 level
Dimensions
Net Weight
2.5 kg
Gross Weight
3.2 kg
Construction
Construction Chassis
Magnesium Alloy
Mounting Configuration
Wall VESA 100, Wall VESA 75
Protection Level of Chassis
IP65
Type
Fanless
Display
Display Type
LCD TFT
Diagonal
12.1 "
Maximum resolution
1024x768 Dots
Aspect Ratio
4:3
Brightness
400 Cd/m2
Contrast Ratio
1000~1
Touch Screen
Touch Screen Type
Capacitive
CPU
Processor Installed
Qualcomm Snapdragon 660
Socket
CPU onboard
Max CPU frequency
2.2 GHz
Chipset
Chipset
SoC
Memory
Socket Type
Soldered
ECC
No
Default on Board Memory
3 GB
Assembly
Fixed on Board
Graphic
Graphic Controller
Integrated in CPU
Ethernet
Total Ethernet
1
10/100/1000 Mbit/s
1
Wi-Fi
Wi-Fi Standard
Yes
Interfaces
COM Total
2
RS-232/422/485
2
USB Total
2
USB 2.0
1
USB v3.x
1
Digital Input-Output
Channels of DIO
4
Drive interfaces
MicroSD
1
Installed drive
Drive Type
SSD
Storage Form-Factor
eMMC
1st Storage Capacity
32 GB
Extension Slots
SIM Card slots
Yes, 2, Nano SIM
Antenna characteristics
Cellular interfaces
4G (Optional)
Additional Functions
GPS
Optional
LED / Controls
LED
Battеry Status, WLAN LED
Controls
On/Off, Function Keys
Connectors
Connectors
2xDB9, RJ45 Ethernet, 1xUSB, DC Input, SIM Card Slot, SD card slot, USB type C
System Power Input
Input Voltage DC
10..60 V
Power Supply
Type of Power Supply
External power adapter AC/DC
Output Power
84 W
Software
Operating System Installed
Android
Dimensions and weight
Width
307 mm
Height
225 mm
Depth
57 mm
Operating Conditions
Operating Temperature
-30..60 °C
Humidity
5-95%
Vibration
MIL-­STD­-810H Method 514.8 Procedure I
Shock
MIL­-STD­-810H Method 516.8 Procedure I
Standards and Certifications
Certifications
CE/FCC
EMS
EN 61000-4-2
MIL-STD-810
MIL-STD-810H Test Method 516.8 Shock, MIL-STD-810H Test Method 514.8 Vibration
Vandal Resistance
EN 62262, IK07 level
Dimensions
Net Weight
2.5 kg
Gross Weight
3.2 kg

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